technical data

Layers 1 to 14
Max. thickness 7.0mm
Materials FR-4, Halogen-free, HI TG, Rogers, Arlon, Nelco
Min. width/spacing Inner layer 3.5 mil/4 mil (Hoz). Outer layer 3.5 mil/4 mil (Hoz)
Max. copper thickness 4 oz  Cu
Min. hole size 6 mil (0.15mm) mechanical drill. 0.1mm laser drill
Max. panel size 600 x 1000 mm
Surface finishes HASL, Immersion tin, OSP, Immersion silver, Gold finger and Immersion gold

fastrax division

A rapid response for prototypes, small batch and sample printed circuit boards. These are manufactured in China, providing high quality boards at very competitive prices. Including our advanced technologies such as Plated & Filled Via Holes (POFV), Laser Drilling and HDI capability place us at the forefront of PCB manufacturing.


fast/agile/responsive