technical data
| Material types | AL1050/1100, AL5052-H34, AL6061-T6 series |
|---|---|
| Line width/spacing | Minimum 5 mil/5 mil (0.127 mm/0.127 mm). Base copper 1 oz |
| Soldermask bridge | Minimum 5 mil (0.127 mm) |
| CNC V-cut | X-Y axis 30, 45, 60 degree, Inline V-cut, Jump V-cut |
| Countersunk hole size | T-type and V-type 0.7 mm at 1.6 mm board thickness |
| Maximum copper thickness | 6 oz Cu |
| Finishing | Hot Air leveling, Immersion gold, Electro-plated gold, OSP. |
| Profiling | Punching, NC routing |
| Assembly | Hot Bar soldering, Reflow process |
| Solderpaste | Lead-free type, Leaded type |
thermal management
Using Opulent® patented IMS (Insulated Metal Substrate) technology, our solutions for thermal management allow the dissipation of heat away from critical components, to extend their working life and increase their efficiency. We can review your design for thermal efficiency and advise on changes and material selection to enhance the product’s functionality.
We can also offer a full LED assembly service at our bespoke facility located in Penang, Malaysia.
